آی سی AUIRF7737

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مشخصات فنی

کاتالوگ محصول : دیتاشیت آی سی AUIRF7737

The AUIRF7737L2 combines the latest Automotive HEXFET Power MOSFET Silicon technology with the advanced DirectFET packaging technology to achieve exceptional performance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infrared or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in automotive power systems

Features

Advanced Process Technology
Optimized for Automotive Motor Drive, DC-DC and other Heavy Load Applications
Exceptionally Small Footprint and Low Profile
High Power Density
Low Parasitic Parameters
Dual Sided Cooling
175°C Operating Temperature